A scribe line consists of a series of small, closely spaced "blind" holes lasered into the substrate under precise computer control. The hole or pulse depth is generally 40% ot the substrate thickness.
Figure 4 - Top & Cross-Section Views of Laser Scribe (Taken at 90x)
Table 1 - Scribe Parameters
Locations Before and After Singulation-
Scribe line locations are inspected using optical comparitor or video inspection equipment, from scribe centerline to scribe centerline.
Scribe Pulse Depth (Average)-
Average laser pulse depth, also called "scribe depth" is inspected on a substrate cross-section using a calibrated microscope with 0.001" increments at a magnification of 30x using surface illumination. The average depth is determined over a minimum of 10 adjacent pulses.
Scribe Pulse Spacing-
Average laser pulse spacing is inspected using a optical comparitor or a calibrated microscope (30x or grater) using surface illumination. The average spacing is determined over a minimum of 10 adjacent pulses.
Slage Height (Ceramic Recast)-
The product of laser cutting and / or scribing. Slag height measurements are taken using a calibrated drop height gauge. Slag height measurements are typiacally specified as <0.001" (0.025mm) in height. Slage height and recast are minimized by the use of LaCoat™
