 |
 |
 |
Ceramic Scribing and Machining • LaTITE™ • Plug-Free Vias • Processing Ceramics Guide
Your vias are shrinking. But along with the benefits of increased circuit density and decreased laser drilling cost, there is a hazard - today's smaller vias can be plugged much more easily by tiny particles of production debris.
Laserage has responded to our customers' requests for guaranteed plug-free vias with an in-house designed, automated via inspection machine. We inspect, at no additional charge, all laser drilled holes smaller than 0.010" (0.25mm) diameter.
Laserage will improve your yields. If any via is found to be plugged, we open it - before you receive the substrate and invest many times its value in your processing costs.
Next time you specify a supplier for laser drilled ceramic, ask yourself this: "Can I afford not to know all my substrate's vias are clear?"
Our unique equipment allows us to accomplish in seconds what time consuming manual inspection can never do - determine with 100% assurance that all vias in your substrate are clear.
- Ceramic substrates for hybrid circuits in automotive applications.
- Ceramic substrates for commercial hybrid electronic applications.
- Small diameter and high density holes for hearing aid circuitry.
- High density small diameter holes for medical sensors and devices.
|
