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Ceramic Scribing and Machining • LaTITE™ • Plug-Free Vias • Processing Ceramics Guide
An economical, proprietary, heat treatment developed by Laserage scientists to enhance metallization adhesion to laser machined sidewalls of holes and edges. Particularly applicable to low or no frit inks, adhesion tests have confirmed pull strengths comparable to, or better than, as fired alumina. LaTITE™ treatment eliminates any reservation hybrid design engineers may have in using laser machined substrates for either high reliability applications or reaping the cost efficiencies of multiple part laser machined arrays.
A natural by-product of laser machining is the ultra thin, but fragile, "columnar layer" on hole walls in ceramic. The process securely fuses or bonds the fragile "columnar layer" to the hole wall. Typically the process is used for reactive (oxide) bonded ink systems substrates to dramatically improve metalization adhesion and thermal cycling performance.
The picture below shows a laser drilled hole wall in a ceramic substrate at high magnification. On the right is a laser drilled hole wall in a ceramic substrate with the LaTITE™ process. It's properties have been restored to those of a raw ceramic substrate.
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